Cadence Announces First-to-Market DisplayPort 2.0 Verification IP
Cadence VIP drives early adoption of next-generation DisplayPort standard for mobile and automotive applications SAN…
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Data I/O Expands Sales Representation with Assembly Products LLC
REDMOND, Wash.–(BUSINESS WIRE)–Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced data and…
WiSA Expands to 6 Leading Global TV Manufacturers
TV Brands Toshiba and Fengmi Join LG Electronics, Sharp, TCL, and Bang & Olufsen to…
Flash Memory Summit Prepares Storage Designers for the Zettabyte Era
Huge amounts of Data Require Multiple Tiers of Storage, the Latest Technologies, and Tremendous Flexibility…
Radisys, Intel and China Mobile Team Up for 5G Open RAN Architecture
China Mobile Research Institute to demonstrate 5G NR sub-6 GHz Standalone (SA) mode reference architecture…
CSG and ITW Global Leaders Forum Announce Partnership to Create Communications Blockchain Network
GREENWOOD VILLAGE, Colo.–(BUSINESS WIRE)–CSG (NASDAQ: CSGS) today announced it has been selected by the ITW…
TDK announces worldwide availability of MEMS-based “sonar on a silicon chip” ultrasonic time-of-flight sensors
Immediate worldwide availability of the Chirp CH-101 ultrasonic sensor CH-101 supports a maximum sensing range…
Littelfuse Breaks Ground on New Power Semiconductor Assembly Facility
New facility in Philippines reinforces commitment to power semiconductor growth with state-of-the-art capabilities and additional…
Avnet Named to Supply & Demand Chain Executive’s 100 Top Supply Chain Transformations for 2019
PHOENIX–(BUSINESS WIRE)–$AVT #AI–Bringing a technology product to market today requires more than just an innovative…
Car IQ Secures $5 Million in Series A Funding to Accelerate Growth of Autonomous Payment Gateway for Vehicles
SAN FRANCISCO–(BUSINESS WIRE)–Car IQ, a leader in vehicle payment technology, announced it has closed Series…